China’s BYD scraps plan to spin off semiconductor firm for listing By Reuters


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HONG KONG (Reuters) – Chinese automaker BYD Co (OTC:) Ltd’s on Tuesday said it has scrapped plans to list its chip unit in China, according to a filing on Shenzhen stock exchange.

The termination of the plan will not have a significant adverse impact on the company’s existing production and operation activities, it added.

According to the prospectus, the chip unit aimed to raise 2 billion yuan ($281.22 million) to fund projects and replenish capital.

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